set inital_v 3454_200.v
set post_cbt_v post_cbt.v
set top_module module_3454
read_db ./lib/MW/umc13sp/LM/scmetro_umcl130e_sp_ss_1p08v_125c.db
read_verilog -r $inital_v
set_top $top_module
read_verilog -i $post_cbt_v
set_top $top_module
verify
exit
Thursday, March 19, 2009
Formality Check Basic Flow
Monday, March 16, 2009
ILM basic flow using ICC
open_mw_cel top_design
create_plan_groups sub_module
create_placement
legalize_placement
allocate_fp_budgets
route_global
analyze_fp_routing -finalize_pins_feedthroughs plan_groups
commit_fp_plan_groups sub_module
save_mw_cel -hierarchy
close_mw_cel sub_module
create_ilm_models sub_module
Tuesday, February 24, 2009
Net delay in ICC timing report
Net delay in ICC timing report is displayed in the input pin connected to the net.
We can see the net delay using report_delay_calculation is not 0.
ICC report_timing log
U3249/y (buf_d10w) 20.3900 42.7837 86.3139 r
n3002 (net) 1 11.0479 0.0000 86.3139 r
U3250/a (buf_d2m_hvt) 20.3900 0.4279 * 86.7417 r
We can see the net delay using report_delay_calculation is not 0.
icc_shell> report_delay_calculation -from U3249/y -to U3250/a
****************************************
Report : delay_calculation
Design : ***
Version: B-2008.09-ICC-SP5
Date : Tue Feb 24 22:40:46 2009
****************************************
From pin: U3249/y
To pin: U3250/a
Main Library Units: 0.001ns 0.001pF 1kOhm
Operating Conditions: ww_v099_t125_maxc Library: sc_lib
arc type: net
Annotated_delay rise: 0.427862
Annotated_delay fall: 0.427862
total delay rise, fall: 0.427862 , 0.427862
ICC report_timing log
****************************************
Report : timing
-path full
-delay max
-input_pins
-nets
-max_paths 1
-transition_time
-capacitance
Design : rsa
Version: B-2008.09-ICC-SP5
Date : Tue Feb 24 22:16:39 2009
****************************************
* Some/all delay information is back-annotated.
# A fanout number of 1000 was used for high fanout net computations.
Operating Conditions: ww_v099_t125_maxc Library: sc_lib
Startpoint: efi_rsa_send_data[46]
(input port)
Endpoint: sa_efi0/efi_rsa_send_data_q_reg[46]
(rising edge-triggered flip-flop clocked by clk)
Path Group: clk
Path Type: max
Point Fanout Cap Trans Incr Path
----------------------------------------------------------------------------------------------
clock (input port clock) (rise edge) 0.0000 0.0000
input external delay 0.0000 0.0000 r
efi_rsa_send_data[46] (in) 15.3220 8.9702 8.9702 r
efi_rsa_send_data[46] (net) 1 4.4576 0.0000 8.9702 r
U3248/a (buf_d10w) 15.3220 0.0632 * 9.0334 r
U3248/y (buf_d10w) 10.3372 34.4874 43.5208 r
n3001 (net) 1 2.4215 0.0000 43.5208 r
U3249/a (buf_d10w) 10.3372 0.0094 * 43.5301 r
U3249/y (buf_d10w) 20.3900 42.7837 86.3139 r
n3002 (net) 1 11.0479 0.0000 86.3139 r
U3250/a (buf_d2m_hvt) 20.3900 0.4279 * 86.7417 r
U3250/y (buf_d2m_hvt) 133.8156 144.4690 231.2107 r
n3003 (net) 1 13.8762 0.0000 231.2107 r
U3251/a (buf_d2m_hvt) 133.8156 0.7055 * 231.9162 r
U3251/y (buf_d2m_hvt) 399.9278 407.3107 639.2269 r
n3004 (net) 1 43.3720 0.0000 639.2269 r
sa_efi0/C279/u442/a1 (nand2b_d2dm_hvt) 399.9278 6.1595 * 645.3865 r
sa_efi0/C279/u442/y (nand2b_d2dm_hvt) 269.8072 417.0488 1062.4353 f
sa_efi0/C279/n25 (net) 1 36.9462 0.0000 1062.4353 f
sa_efi0/C279/u609/a (inv_d30m_hvt) 269.8072 4.6215 * 1067.0568 f
sa_efi0/C279/u609/y (inv_d30m_hvt) 61.7449 84.7218 1151.7786 r
sa_efi0/N27 (net) 1 11.9103 0.0000 1151.7786 r
sa_efi0/efi_rsa_send_data_q_reg[46]/d (mdff_d10dm) 61.7449 0.3622 * 1152.1407 r
data arrival time 1152.1407
clock clk (rise edge) 833.0000 833.0000
clock network delay (ideal) 0.0000 833.0000
clock uncertainty -100.0000 733.0000
sa_efi0/efi_rsa_send_data_q_reg[46]/clk (mdff_d10dm) 0.0000 733.0000 r
library setup time -87.8789 645.1211
data required time 645.1211
----------------------------------------------------------------------------------------------
data required time 645.1211
data arrival time -1152.1407
----------------------------------------------------------------------------------------------
slack (VIOLATED) -507.0197
1
Friday, February 6, 2009
Physical Design Rule
What's Physical Design Rule
Why Physical Design Rule:
Basic Physical Design Rule:
For Logic Design Rule, please refer to http://vlsi-concept.blogspot.com/2009/01/design-rule-checking-drc.html
1. Interface between the circuit designer and process engineer
2. Guidelines for constructing process masks
3. Unit dimension: minimum line width
2. Guidelines for constructing process masks
3. Unit dimension: minimum line width
scalable design rules: lambda parameter
absolute dimensions: micron rules
absolute dimensions: micron rules
4. Rules constructed to ensure that design works even when small fab errors (within some tolerance) occur
5. A complete set includes
5. A complete set includes
set of layers
intra-layer: relations between objects in the same layer
inter-layer: relations between objects on different layers
intra-layer: relations between objects in the same layer
inter-layer: relations between objects on different layers
Why Physical Design Rule:
To be able to tolerate some level of fabrication errors such as
1. Mask misalignment
2. Dust
3. Process parameters (e.g., lateral diffusion)
4. Rough surfaces
2. Dust
3. Process parameters (e.g., lateral diffusion)
4. Rough surfaces
Basic Physical Design Rule:
- Width (INTERNAL)
- Spacing (EXTERNAL)
- Overlap (ENCLOSE)
- Extension (ENCLOSE)
- Clearance (EXTERNAL, ENCLOSE)
For Logic Design Rule, please refer to http://vlsi-concept.blogspot.com/2009/01/design-rule-checking-drc.html
Thursday, February 5, 2009
ASIC Design Implementation Flow In Brief
- design setup;
- floorplan;
- placement;
- Clock Tree synthesis (CTS);
- routing;
- chip finishing( insert diode, insert filler, insert metal filler, add redundant via …);
- signoff flow ( StarRCXT, PT, DRC, LVS).
ASIC Design Flow In Brief
- chip specification;
- front end modeling, use C, C++ or System C/system verilog to do the modeling and simulation;
- design implementation in front end, verilgo or VHDL ;
- simulation;
- FPGA verification(optional);
- Synthesis, Design compiler , RTL to gate level netlist;
- Physical implementation.
- Post simulation ( simulation with back-annotate SDF)
- signoff ( StarRCXT, PrimeTime, Hercules).
- set data to foundry ( GDSII file ), OPC.
- manufacturing.
- Test and packaging.
Wednesday, February 4, 2009
Mapping File: Database Layer <==> Process Layer
Maps File:
Map database layers to process layers conducting_layers, via_layers, marker_layers, remove_layers.
Layer Information:
Resistance information is optional: RPSQ (for conductors) or RPV (for vias) overrides process file, if specified
via_layers: need to be mapped to the corresponding physical layers
removed_layers: Those layers do not need to do extraction
Map file Example:
http://gudonghua.googlepages.com/map-file-example.map.txt
Map database layers to process layers conducting_layers, via_layers, marker_layers, remove_layers.
Layer Information:
Resistance information is optional: RPSQ (for conductors) or RPV (for vias) overrides process file, if specified
via_layers: need to be mapped to the corresponding physical layers
removed_layers: Those layers do not need to do extraction
Map file Example:
http://gudonghua.googlepages.com/map-file-example.map.txt
Subscribe to:
Posts (Atom)