Net delay in ICC timing report

Net delay in ICC timing report is displayed in the input pin connected to the net.

U3249/y (buf_d10w)                                             20.3900   42.7837    86.3139 r
n3002 (net)                                   1      11.0479              0.0000    86.3139 r
U3250/a (buf_d2m_hvt)                                          20.3900    0.4279 *  86.7417 r

We can see the net delay using report_delay_calculation is not 0.

icc_shell> report_delay_calculation -from U3249/y -to U3250/a

****************************************
Report : delay_calculation
Design : ***
Version: B-2008.09-ICC-SP5
Date   : Tue Feb 24 22:40:46 2009
****************************************

From pin:                         U3249/y
To pin:                           U3250/a
Main Library Units:  0.001ns  0.001pF  1kOhm


Operating Conditions: ww_v099_t125_maxc   Library: sc_lib

arc type:                         net
Annotated_delay rise:             0.427862
Annotated_delay fall:             0.427862
total delay rise, fall:           0.427862 , 0.427862

ICC report_timing log

****************************************
Report : timing
  -path full
  -delay max
  -input_pins
  -nets
  -max_paths 1
  -transition_time
  -capacitance
Design : rsa
Version: B-2008.09-ICC-SP5
Date   : Tue Feb 24 22:16:39 2009
****************************************

* Some/all delay information is back-annotated.

# A fanout number of 1000 was used for high fanout net computations.

Operating Conditions: ww_v099_t125_maxc   Library: sc_lib

Startpoint: efi_rsa_send_data[46]
        (input port)
Endpoint: sa_efi0/efi_rsa_send_data_q_reg[46]
      (rising edge-triggered flip-flop clocked by clk)
Path Group: clk
Path Type: max

Point                                       Fanout       Cap     Trans      Incr       Path
----------------------------------------------------------------------------------------------
clock (input port clock) (rise edge)                                      0.0000     0.0000
input external delay                                                      0.0000     0.0000 r
efi_rsa_send_data[46] (in)                                     15.3220    8.9702     8.9702 r
efi_rsa_send_data[46] (net)                   1       4.4576              0.0000     8.9702 r
U3248/a (buf_d10w)                                             15.3220    0.0632 *   9.0334 r
U3248/y (buf_d10w)                                             10.3372   34.4874    43.5208 r
n3001 (net)                                   1       2.4215              0.0000    43.5208 r
U3249/a (buf_d10w)                                             10.3372    0.0094 *  43.5301 r
U3249/y (buf_d10w)                                             20.3900   42.7837    86.3139 r
n3002 (net)                                   1      11.0479              0.0000    86.3139 r
U3250/a (buf_d2m_hvt)                                          20.3900    0.4279 *  86.7417 r
U3250/y (buf_d2m_hvt)                                         133.8156  144.4690   231.2107 r
n3003 (net)                                   1      13.8762              0.0000   231.2107 r
U3251/a (buf_d2m_hvt)                                         133.8156    0.7055 * 231.9162 r
U3251/y (buf_d2m_hvt)                                         399.9278  407.3107   639.2269 r
n3004 (net)                                   1      43.3720              0.0000   639.2269 r
sa_efi0/C279/u442/a1 (nand2b_d2dm_hvt)                        399.9278    6.1595 * 645.3865 r
sa_efi0/C279/u442/y (nand2b_d2dm_hvt)                         269.8072  417.0488   1062.4353 f
sa_efi0/C279/n25 (net)                        1      36.9462              0.0000   1062.4353 f
sa_efi0/C279/u609/a (inv_d30m_hvt)                            269.8072    4.6215 * 1067.0568 f
sa_efi0/C279/u609/y (inv_d30m_hvt)                             61.7449   84.7218   1151.7786 r
sa_efi0/N27 (net)                             1      11.9103              0.0000   1151.7786 r
sa_efi0/efi_rsa_send_data_q_reg[46]/d (mdff_d10dm)             61.7449    0.3622 * 1152.1407 r
data arrival time                                                                  1152.1407

clock clk (rise edge)                                                   833.0000   833.0000
clock network delay (ideal)                                               0.0000   833.0000
clock uncertainty                                                       -100.0000  733.0000
sa_efi0/efi_rsa_send_data_q_reg[46]/clk (mdff_d10dm)                      0.0000   733.0000 r
library setup time                                                      -87.8789   645.1211
data required time                                                                 645.1211
----------------------------------------------------------------------------------------------
data required time                                                                 645.1211
data arrival time                                                                  -1152.1407
----------------------------------------------------------------------------------------------
slack (VIOLATED)                                                                   -507.0197


1

Physical Design Rule

What's Physical Design Rule

1. Interface between the circuit designer and process engineer
2. Guidelines for constructing process masks
3. Unit dimension: minimum line width

scalable design rules: lambda parameter
absolute dimensions: micron rules

4. Rules constructed to ensure that design works even when small fab errors (within some tolerance) occur
5. A complete set includes

set of layers
intra-layer: relations between objects in the same layer
inter-layer: relations between objects on different layers

Why Physical Design Rule:

To be able to tolerate some level of fabrication errors such as

1. Mask misalignment
2. Dust
3. Process parameters (e.g., lateral diffusion)
4. Rough surfaces

Basic Physical Design Rule:

1. Width (INTERNAL)
2. Spacing (EXTERNAL)
3. Overlap (ENCLOSE)
4. Extension (ENCLOSE)
5. Clearance (EXTERNAL, ENCLOSE)

For Logic Design Rule, please refer to http://vlsi-concept.blogspot.com/2009/01/design-rule-checking-drc.html

ASIC Design Implementation Flow In Brief

1. design setup;
2. floorplan;
3. placement;
4. Clock Tree synthesis (CTS);
5. routing;
6. chip finishing( insert diode, insert filler, insert metal filler, add redundant via …);
7. signoff flow ( StarRCXT, PT, DRC, LVS).

ASIC Design Flow In Brief

1. chip specification;
2. front end modeling, use C, C++ or System C/system verilog to do the modeling and simulation;
3. design implementation in front end, verilgo or VHDL ;
4. simulation;
5. FPGA verification(optional);
6. Synthesis, Design compiler , RTL to gate level netlist;
7. Physical implementation.
8. Post simulation ( simulation with back-annotate SDF)
9. signoff ( StarRCXT, PrimeTime, Hercules).
10. set data to foundry ( GDSII file ), OPC.
11. manufacturing.
12. Test and packaging.

Mapping File: Database Layer <==> Process Layer

Maps File:
    Map database layers to process layers conducting_layers, via_layers, marker_layers, remove_layers.

Layer Information:
    Resistance information is optional: RPSQ (for conductors) or RPV (for vias) overrides process file, if specified
    via_layers: need to be mapped to the corresponding physical layers
    removed_layers: Those layers do not need to do extraction

Map file Example:
    http://gudonghua.googlepages.com/map-file-example.map.txt